LRCX expands into PLP as larger AI chips drive demand, targeting a fast-growing advanced-packaging opportunity.

Panel Horizontal Electroplating Toward Volume Production and Strengthens ACM’s Position in Advanced PackagingFREMONT, Calif., ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor ...

Use left and right arrow keys to seek audio. TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at ...

CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) ...

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CEO Robert Daigle introduced Mark Weaver as Interim CFO, highlighting Weaver's prior experience at Rogers Corporation and NXP Semiconductors, and noted that the CFO search is ongoing. Daigle reported, ...

TSMC EMIB packaging is now in active development: the world's dominant chipmaker is building an Intel-style bridge architecture with Kinsus Interconnect, sending both TSMC and Intel stocks surging.

SINGAPORE, Oct. 15, 2025 /PRNewswire/ -- Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, announced it has shipped 100-million-units from its flagship factory ...

In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging Consortium. The consortium, which had 17 partners, developed various equipment and materials in the arena. Several ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level fan-out packaging ...